MICROELECTRONICS Packaging handbook : technology drivers - Part 1
| Other Authors: | |
|---|---|
| Format: | Book |
| Published: |
New York:
ITP Pub.,
1997.
|
| Edition: | 2nd ed.. |
| Subjects: |
| LEADER | 00489pamaa2200145 4500 | ||
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| 001 | 0000023804 | ||
| 005 | 20070215090000.0 | ||
| 020 | 0 | 0 | |a 0412084317 |
| 090 | 0 | 0 | |a TK7874 |b MIC 1997 |
| 245 | 0 | 0 | |a MICROELECTRONICS Packaging handbook : |b technology drivers - Part 1 |c edited by Rao R. Tummala, Eugene J. Rymaszewski and Alan G. Klopfenstein. |
| 250 | 0 | 0 | |a 2nd ed.. |
| 260 | 0 | 0 | |a New York: |b ITP Pub., |c 1997. |
| 300 | |a xxvvii, 720p.: |b ill.; |c 24cm. | ||
| 650 | 0 | 0 | |a Microelectronics |
| 700 | 1 | 1 | |a Tummala, |h Rao R. |