|
|
|
|
| LEADER |
00793pamaa2200217 4500 |
| 001 |
0000023088 |
| 005 |
20090826090000.0 |
| 008 |
090826 eng |
| 020 |
0 |
0 |
|a 9780471466093
|
| 082 |
|
|
|a 621.381046 ADV
|
| 090 |
0 |
0 |
|a TK7874
|b ADV 2006
|
| 245 |
0 |
0 |
|a Advanced electronic packaging
|c edited by William D. Brown, Richard K. Ulrich.
|
| 250 |
0 |
0 |
|a 2nd ed.
|
| 260 |
0 |
0 |
|a Hoboken, NJ : Wiley ; Piscataway, NJ:
|b IEEE Press,
|c 2006.
|
| 300 |
|
|
|a xxvi, 812p.:
|b ill.;
|c 26cm.
|
| 440 |
0 |
0 |
|a IEEE Press series on microelectronic systems
|
| 504 |
0 |
0 |
|a Includes bibliographical references and index
|
| 650 |
0 |
0 |
|a Microelectronic packaging
|
| 650 |
0 |
0 |
|a Multichip modules (microelectronics) --
|x Design and construction
|
| 700 |
1 |
1 |
|a Brown,
|h William D.
|
| 700 |
1 |
1 |
|a Ulrich,
|h Richard K.
|
