Modern solder technology for competitive electronics manufacturing
| Main Author: | |
|---|---|
| Format: | Book |
| Published: |
New York:
McGraw Hill,
1996.
|
| Subjects: |
| LEADER | 00463pamaa2200157 4500 | ||
|---|---|---|---|
| 001 | 0000022560 | ||
| 005 | 20070720090000.0 | ||
| 020 | 0 | 0 | |a 0070317496 |
| 082 | |a 621.381046 HWA | ||
| 090 | 0 | 0 | |a TK7870.15 |b HWA 1996 |
| 100 | 1 | 0 | |a Hwang |
| 245 | 1 | 0 | |a Modern solder technology for competitive electronics manufacturing |c Jennie S. Hwang. |
| 260 | 0 | 0 | |a New York: |b McGraw Hill, |c 1996. |
| 300 | |a xliv, 622p.; |c 24cm. | ||
| 650 | 0 | 0 | |a Electronic packaging |
| 650 | 0 | 0 | |a Solder and soldering |